Θέμα χωρίς απαντήσεις

[iPhoneHellas]

iPhone 3G: Οι περισσότεροι δεν το έχουμε δει καν από κοντά... κάποιοι όχι μόνο το είδαν, αλλά το κάνανε κομμάτια με σκοπό να αποκαλύψουν τι κρύβει το εσωτερικό του!
Από αριστερά προς τα δεξιά:Display glass, LCD, Main board and EMI shield, Antenna and battery, Back panel. 
Τι κρύβει λοιπόν το iPhone 3G στα 'σωθικά' του;
- The LCD and glass covering are separate components-- just like the iPod Touch.
- In the previous iPhone, the display was fairly monolithic. A number of components were connected together via the display assembly-- now the display just connects to the main board.
- The two boards (logic and communications) are now one.
Components:
Intel NOR flash: 3050M0Y0CE 5818A456
Skyworks power amplifier SKY77340 (Power Amplifier Module Quad)
SMP 3i Chip, Infineon SMARTi Power 3i.From Infineon: "optimized to support modem and data card applications based upon X-GOLD208 and X-GOLD 608, with features ranging from EDGE up to 3G and HSDPA."
TriQuint Tritium PA-duplexers: TQM616035 TQM676031 TQM666032.
There are Samsung memory markers on the processor (again).
Samsung memory on the chip (K4X1G163PC-DGC3) is slightly different from the first iPhone, which was K4X1G153PC.
SST25VF040B 4Mbit SPI Serial Flash.
[Via iFixit]